The differences between adiabatic, isochoric, isobaric, and isothermal processes.

An insulated 40 ft^3 rigid tank contains air at 50 psia and 120°f. a valve connected to the tank is now opened, and air is allowed to escape until the pressure inside drops to 25 psia. the air temperature during this process is kept constant by an electric resistance heater placed in the tank. determine the electrical work done during this process.

Acarpenter builds an exterior house wall with a layer of wood 2.9 cm thick on the outside and a layer of styrofoam insulation 2.3 cm thick on the inside wall surface. the wood has k=0.080w/(m⋅k), and the styrofoam has k= 0.010 w/(m⋅k). the interior surface temperature is 19.0 ∘c , and the exterior surface temperature is -15.0 ∘c . a.)what is the temperature at the plane where the wood meets the styrofoam? celsius b.)what is the rate of heat flow per square meter through this wall? /m^2

Consider the growth of a 20-nm-diameter silicon nanowire onto a silicon wafer. the temperature of the wafer surface is maintained at 2400 k. assume the thermal conductivity of the silicon nanowire is 20 wm-1k-1 and all its surfaces including the tip are subjected to convection heat transfer with the coefficient h = 1×105 wm-2k-1 and t∞ = 8000 k. when the nanowire grows to l = 300 nm, what is the temperature of the nanowire tip (t (x =