2. a package with a heat sink and fan has a thermal resistance to the ambient of 8 °c/w. the thermal resistance from the die to the package is 2 °c/w. if the package is in a chassis that will never exceed 50 °c and the maximum acceptable die temperature is 110 °c, how much power can the chip dissipate?
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Aforce of 100 newtons is used to move an object a distance of 15 meters with a power of 50 watts. find the work dine and the time it takes to do the work
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Drag the tiles to the correct boxes to complete the pairs. match the jobs with the education requirements. childcare director clinical psychologist concierge cosmetologist vocational school and state licensure arrowright on-the-job training arrowright a ph. d. with licensure or certification, depending on the state in which you live arrowright a bachelor’s degree in early childhood development arrowright
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2. a package with a heat sink and fan has a thermal resistance to the ambient of 8 °c/w. the thermal...
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