In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metallization. The etch rate is an important characteristic of this process and known to follow a normal distribution. Two different etching solutions have been compared using two random samples of 10 wafers for each solution. Assume the variances are equal. The etch rates are as follows (in ml per minute):

Solution 1 Solution 2
9.8 10.4 10.2 10.0
9.4 10.3 10.6 10.2
9.3 10.0 10.7 10.7
9.6 10.3 10.4 10.4
10.2 10.1 10.5 10.3

(a) Calculate the sample mean for solution 1.

(b) Calculate the sample standard deviation for solution 1.

(c) Calculate the sample mean for solution 2.

(d) Calculate the sample standard deviation for solution 2.

(e) Test the hypothesis H0:m1=m2 versus H1:m1≠m2.

Calculate t0.

(f) Calculate a 95% two-sided confidence interval on the difference in mean etch rate.