Integrated circuits consist of electric channels that are etched onto silicon wafers. a certain proportion of circuits are defective because of "undercutting," which occurs when too much material is etched away so that the channels, which consist of the unetched portions of the wafers, are too narrow. a redesigned process, involving lower pressure in the etching chamber, is being investigated. the goal is to reduce the rate of undercutting to less than 5%. out of the first 1000 circuits manufactured by the new process, only 32 show evidence of undercutting. can you conclude that the goal has been met? find the p-value and state a conclusion.

reduce the friction between its moving parts

step-by-step explanation:

in fact, by reducing the friction between the moving parts of the machine, it is possible to reduce the energy wasted due to this friction; therefore, more input energy is converted into useful work, and this will improve the efficiency of the machine.

the 3rd on is correct

step-by-step explanation:

answer:   28.56 feet (approx)

step-by-step explanation:

since, triangle abc has measure of angle c equal to 55 degrees, measure of angle abc equal to 90 degrees, and length of bc equal to 20 feet.

we have to find out the measurement of segment ab.

therefore, tan 55° =

but bc = 20 feet.

⇒ tan 55 ° =  

⇒ ab = 20 × tan 55 °

⇒ ab = 20 × 1.42814800674

⇒ ab = 28.5629601348   ≈ 28.56 feet