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Condition monitoring is a major component of. (clo4) a)- predictive maintenance. b)-preventive maintenance c)-proactive maintenance d)-reactive maintenance.

Ahelical coil spring has a mean diameter of 50 mm, a wire diameter of 5.5 mm and is wound with a pitch of 10 mm. the spring steel has an ultimate strength of 1250 mpa. find the force needed to compress the spring solid and the wire stress in this condition. state whether the spring will return to its initial length.

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction