Engineering, 04.05.2021 21:20, shanicar33500

What are problematic materials in mechanical engineering (environmentally and health)???

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Engineering, 04.07.2019 19:10, jennymares

Abarometer contains mercury with a density of 13600 kg/m3. atmospheric conditions are 95.8 kpa and 20 °c at 20 °c, the vapor pressure of the mercury is 0.000173 kpa. the column of mercury will rise to a height of most nearly. select one: a)- 0.38 m b)- 0.82 m c)- 0.48 m d)- 0.72 m

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Engineering, 04.07.2019 19:20, anggar20

Air enters a horizontal, constant-diameter heating duct operating at steady state at 290 k, 1 bar, with a volumetric flow rate of 0.25 m°/s, and exits at 325 k, 0.95 bar. the flow area is 0.04 m2. assuming the ideal gas model with k = 1.4 for the air, determine (a) the velocity at the inlet and exit, each in m/s, and (c) the rate of heat transfer, in kw flow rate, in kg/s, (b) the mass kg 0.3

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Engineering, 04.07.2019 19:20, nikkiebartels

Afan that can provide air speeds up to 60 m/s is to be used in a low-speed wind tunnel with atmospheric air at 35 c. if one wishes to use the wind tunnel to study flat-plate boundary layer behavior up to reynolds numbes of re 10, what is the minimum plate length that should be used? at what distance from the leading edge would transition occur if the critical reynolds nurnber were rer, e = 5 × 105?

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Engineering, 06.07.2019 02:30, khalilh1206

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction