Engineering, 26.04.2021 20:50, kell22wolf
Which of the following devices can be used to accelerate the process of convection?
A. window fans, ceiling fans, whole-house fans
B. whole-house fans, ceiling fans, alr conditioners
C. window fans, alr-conditioners, whole-house fans
D. window fans, ceiling fans, air conditioners
Answers: 1
Engineering, 03.07.2019 14:10, bryneosburn
Line joining liquid phase with liquid and solid phase mixture is known as: a) liquidus b) solidus c) tie line d) none of the mentioned
Answers: 2
Engineering, 03.07.2019 14:10, volleyballfun24
If the thermal strain developed in polyimide film during deposition is given as 0.0044. assume room temperature is kept at 17.3 c, and thermal coefficient of expansion for the film and the substrate are 54 x 10^-6c^-1 and 3.3 x 10^-6c^-1respectively. calculate the deposition temperature.
Answers: 3
Engineering, 04.07.2019 18:10, johnthienann58
Thermal stresses are developed in a metal when its a) initial temperature is changed b) final temperature is changed c) density is changed d) thermal deformation is prevented e) expansion is prevented f) contraction is prevented
Answers: 2
Which of the following devices can be used to accelerate the process of convection?
A. window fans...
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