Answers: 3
Engineering, 06.07.2019 02:30, khalilh1206
1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85Β°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction
Answers: 1
Engineering, 06.07.2019 03:10, liliauedt
Explain the strain-hardening phenomenon on the basis of dislocation - dislocation strain field interactions. also, briefly describe what generally happens to the ductility of a metal that has been strain hardened (i. e. does strain hardening make a metal more ductile or
Answers: 3
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