Engineering, 13.03.2021 01:00, aud50

A thin silicon chip and an 8-mm-thick aluminum substrate are separated by a 0.02-mm-thick epoxy joint. The chip and substrate are each 10 mm on a side, and their exposed surfaces are cooled by air, which is at a temperature of 25 C and provides a convection coefficient of 100 W/m2 K. If the chip dissipates 104 W/m2 under normal conditions, will it operate below a maximum allowable temperature of 85 C

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A thin silicon chip and an 8-mm-thick aluminum substrate are separated by a 0.02-mm-thick epoxy join...