Engineering, 18.02.2021 23:10, isabelvaldez123

4 pts) You are working in a MEMS process with a single, 10 micron thick polySi layer that can be released and suspended above the substrate. The minimum feature size (both line and space) in your process is 2 microns. We will define the z-axis to be out of the wafer plane and the x-axis and y-axis to be in the plane of the wafer. Design an accelerometer geometry that has a displacement sensitivity of 1 micron/G where 1 G

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4 pts) You are working in a MEMS process with a single, 10 micron thick polySi layer that can be rel...