Engineering
Engineering, 10.04.2020 22:57, Nyasiabaltimore3

Forced air at 25C and 10m/s is used to cool chips on a circuit board. Consider a chip, 4mm x 4mm, located 120mm from the leading edge of the board. An empirical correlation has been established for the local Nusselt number:

Nu_x = 0.04 * Re_x^0.85 * Pr^(1/3)

Estimate the surface temperature of the chip if it is dissipating 30mW.

(Thermophysical properties of air at 25C are needed to solve this problem. Please state your reference source for this information.)

answer
Answers: 3

Other questions on the subject: Engineering

image
Engineering, 03.07.2019 14:10, bryneosburn
Line joining liquid phase with liquid and solid phase mixture is known as: a) liquidus b) solidus c) tie line d) none of the mentioned
Answers: 2
image
Engineering, 04.07.2019 18:10, johnthienann58
Thermal stresses are developed in a metal when its a) initial temperature is changed b) final temperature is changed c) density is changed d) thermal deformation is prevented e) expansion is prevented f) contraction is prevented
Answers: 2
image
Engineering, 04.07.2019 18:20, dlr1628
Acertain flow of air (at stp) has a velocity distribution given by v i (in ft/s). if this flow is going through a 4 ft square area in the yz-plane (centered at the origin), what is the mass flow rate (in lbm/s)?
Answers: 2
image
Engineering, 04.07.2019 18:20, RiverH246
Air flows over a heated plate àt a velocity of 50m/s. the local skin factor coefficient at a point on a plate is 0.004. estimate the local heat transfer coefficient at this point. the following property data for air are given: density = 0.88kg/m3 , viscosity 2.286 x 10 ^-5 kgm/s , k = 0.035w/mk ,cp = 1.001kj/kgk. use colburn reynolds analogy.
Answers: 1
Do you know the correct answer?
Forced air at 25C and 10m/s is used to cool chips on a circuit board. Consider a chip, 4mm x 4mm, lo...

Questions in other subjects:

Konu
History, 08.11.2019 12:31