4. Consider a scenario with a transmitter and a receiver that are separated by some distance. The transmitter uses a power level of 200 mW. A cable connects the transmitter to its antenna. The receiver also has a cable connecting it to its antenna. Each cable has a loss of 2 dB. The transmitting and receiving antenna each have a gain of 5 dBi. What is the resulting EIRP?

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction