Engineering
Engineering, 16.03.2020 21:09, martinezlittleman

You are asked to measure nondestructively the yield strength and tensile strength of an annealed 65–45–12 cast iron structural member. Fortunately, a small hardness indentation in this structural design will not impair its future usefulness, which is a working definition of nondestructive. A 10-mm-diameter tungsten carbide sphere creates a 4.26-mm-diameter impression under a 3000-kg load. What are the yield and tensile strengths?

answer
Answers: 1

Other questions on the subject: Engineering

image
Engineering, 04.07.2019 18:10, Fahaddie
The thermal expansion or contraction of a given metal is a function of the f a)-density b)-initial temperature c)- temperature difference d)- linear coefficient of thermal expansion e)- final temperature f)- original length
Answers: 2
image
Engineering, 04.07.2019 18:20, maciemarklin79981
A3-mm-thick panel of aluminum alloy (k 177 w/m-k, c 875 j/kg-k and ? = 2770 kg/m) is finished on both sides with an epoxy coating that must be cured at or above t,-150°c for at least 5 min. the production line for the curing operation involves two steps: (1) heating in a large oven with air at ts,0-175°c and a convection coefficient of h, 40 w/m2. k, and (2) cooling in a large chamber with air at 25°c and a con- vection coefficient of he 10 w/m2.k. the heating portion of the process is conducted over a time interval te which exceeds the ime required to reach 150°c by 5 min (h = r + 300 s). the coating has an emissivity of ? = 0.8, and the temperatures of the oven and chamber walls are 175 and 25°c, respectively. if the panel is placed in the oven at an initial temperature of 25°c and removed from the chamber at a safe-to-touch tempera ture of 37°c, what is the total elapsed time for the two-step curing operation?
Answers: 3
image
Engineering, 06.07.2019 02:30, chickennbutt0730
On solidification from a melt, the polymer polyethylene forms a semi-crystalline spherulite structure. (i) sketch an individual spherulite and label the amorphous and crystalline regions. (ii) draw a schematic to show the changes in specific volume with temperature during cooling from the melt, comparing it to the theoretical extremes of fully crystalline and fully amorphous (indicate tm and tg)
Answers: 2
image
Engineering, 06.07.2019 02:30, khalilh1206
1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction
Answers: 1
Do you know the correct answer?
You are asked to measure nondestructively the yield strength and tensile strength of an annealed 65–...

Questions in other subjects:

Konu
Mathematics, 28.02.2020 03:46