Engineering, 03.03.2020 04:27, autumnmeadows20

The substitutional diffusion of Ni (solute) in Cu (solvent) is a a. thermally activated process (improves with temperature) b. increases in rate with increasing temperature c. requires the presence of vacancies d. all of the above

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The substitutional diffusion of Ni (solute) in Cu (solvent) is a a. thermally activated process (imp...