A piston cylinder device contains .04 kg of air intialy at 250 kpa , 35 c during a quasiequilibrium isothermal proccess the pressure increases to 750 kpa while the paddle wheel simoltanisly does 10 kj of work on the air

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction

Different between boring and turning?

Write a technical essay (maximum two pages) about stress concentration. and paste from the textbook. instead, read updated material about this phenomenon and provide a technical evaluation of the different techniques to avoid/reduce such phenomenon. consider in your analysis cutting-edge computational techniques such as fea to study and analyze stress concentrations.