Acircuit-level design is implemented and expressed in terms of components, devices, and voltage–current relationships. the lowest level is device-level design, which involves selecting types of devices. before starting this level of design, you must have some knowledge of electronic devices and their characteristics, parameters, and models. as a part of this discussion, explain various steps involved in the design of a circuit to measure dc voltage in the range from 0 to 20 v. design specifications: for a full-scale deflection, the indicating meter draws 100μa at a voltage of 1 v across it. the current drawn from the dc supply should not exceed 1 ma. you may refer to the example 1.1 in the textbook to discuss the design process.

During a steady flow process, the change of energy with respect to time is zero. a)- true b)- false

The flow rate of air through a through a pipe is 0.02 m5/s. a pitot static tube is placed in the flow. the radius of the pitot static tube is 1 mm. assuming the flow to be steady and the air to be at 300k, calculate the difference in total and static pressure if the diameter of the pipe is: (a) d 0.1 m d 0.05 m (c) d 0.01 m

A3-mm-thick panel of aluminum alloy (k 177 w/m-k, c 875 j/kg-k and ? = 2770 kg/m) is finished on both sides with an epoxy coating that must be cured at or above t,-150°c for at least 5 min. the production line for the curing operation involves two steps: (1) heating in a large oven with air at ts,0-175°c and a convection coefficient of h, 40 w/m2. k, and (2) cooling in a large chamber with air at 25°c and a con- vection coefficient of he 10 w/m2.k. the heating portion of the process is conducted over a time interval te which exceeds the ime required to reach 150°c by 5 min (h = r + 300 s). the coating has an emissivity of ? = 0.8, and the temperatures of the oven and chamber walls are 175 and 25°c, respectively. if the panel is placed in the oven at an initial temperature of 25°c and removed from the chamber at a safe-to-touch tempera ture of 37°c, what is the total elapsed time for the two-step curing operation?