The electronic packaging trend in the memory chip industry has seen the evolution from using a tsop package to a low cost solder bumped csp with a flexible interposer. what advantages does the csp have over the tsop?

Amass of m 1.5 kg of steam is contained in a closed rigid container. initially the pressure and temperature of the steam are: p 1.5 mpa and t 240°c (superheated state), respectively. then the temperature drops to t2= 100°c as the result of heat transfer to the surroundings. determine: a) quality of the steam at the end of the process, b) heat transfer with the surroundings. for: p1.5 mpa and t 240°c: enthalpy of superheated vapour is 2900 kj/kg, specific volume of superheated vapour is 0. 1483 m/kg, while for t 100°c: enthalpy of saturated liquid water is 419kj/kg, specific volume of saturated liquid water is 0.001043m/kg, enthalpy of saturated vapour is 2676 kj/kg, specific volume of saturated vapour is 1.672 m/kg and pressure is 0.1 mpa.

Wiy doeres rere okhn a pump whon working betwon the same pressure range?

Tech a says never use a water hose to clean up dust after a repair. tech b says never use a floor scrubber to clean up dust after repairs. who is correct?