Engineering
Engineering, 26.11.2019 03:31, ShexSmart1646

Answer true of false to the following statements. above its glass transition temperature, a polymer is glassy and brittle. below the glass transition temperature, polymer chains lose their mobility (they are less capable of bending, flexing, raveling, and rotating about covalent bonds along the backbone. the glass transition temperature of a material is normally above its melting temperature. the elastic modulus of a polymer decreases when it is heated above its glass transition temperature

answer
Answers: 3

Other questions on the subject: Engineering

image
Engineering, 04.07.2019 18:10, 19deleonl
Coiled springs ought to be very strong and stiff. si3n4 is a strong, stiff material. would you select this material for a spring? explain.
Answers: 2
image
Engineering, 04.07.2019 18:20, kendrawalraven
The characteristic roots of a dynamic system are: 1.7920 1.8160 i, -1.7920 1.8160 i, -0.4160 what is the order of this system? what are the settling time and damping ratio of the system?
Answers: 3
image
Engineering, 04.07.2019 19:10, thawkins79
Agas contained within a piston-cylinder assembly e end nation about same energy states, 1 and 2, where pi 10 bar, v undergoes two processes, a and b, between the sam 0.1 m3, ui-400 kj and p2 1 bar, v2 1.0 m2, u2 200 kj: process a: process from 1 to 2 during which the pressure- volume relation is pv constant process b: constant-volume process from state 1 to a pressure of 2 bar, followed by a linear pressure-volume process to +20 0 state 2 kinetic and potential energy effects can be ignored. for each of the processes a and b, (a) sketch the process on p-v coordinates, (b) evaluate the work, in kj, and (c) evaluate process the heat transfer, in kj
Answers: 2
image
Engineering, 06.07.2019 02:30, khalilh1206
1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction
Answers: 1
Do you know the correct answer?
Answer true of false to the following statements. above its glass transition temperature, a polymer...

Questions in other subjects:

Konu
History, 11.07.2019 20:00
Konu
History, 11.07.2019 20:00