Define various optical properties of engineering materials

Thermal stresses are developed in a metal when its a) initial temperature is changed b) final temperature is changed c) density is changed d) thermal deformation is prevented e) expansion is prevented f) contraction is prevented

Which from the following instrument is commonly used to detect the high pitch butzing sound in bearings? [clo4] a)-digital ultrasonic meter b)-infrared camera c)-spectroscopic d)-vibrometer

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction