Athree-point bend test is performed on a block of silicon carbide that is 10 cm long, 1.5 cm wide, and 0.6 cm thick and is resting on two supports 7.5 cm apart. the sample breaks when a deflection of 0.09 mm is recorded. the flexural modulus for silicon carbide is 480 gpa. assume that no plastic deformation occurs. calculate (a) the force that caused the fracture; and (b) the flexural strength.

Condition monitoring is a major component of. (clo4) a)- predictive maintenance. b)-preventive maintenance c)-proactive maintenance d)-reactive maintenance.

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction

Oxygen at 300 kpa and 400 k is in a closed system with an initial volume of 0.1 m3. is now compressed in a polytropic process, with exponent of n 1.2, to a temperature of 500 k. calculate: a) the boundary work done during the compression, in kj b) the heat transfer during the compression, in kj