Engineering

Engineering, 13.09.2019 22:30, hollie62

The yield of good chips in multiprobe for a certain batch of wafers is 75%. the wafers have a diameter of 300 mm with a processable area that is 280 mm in diameter. if the defects are all assumed to be point defects, determine the density of point defects using the bose-einstein method of estimating yield.

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Computers and Technology, 30.06.2019 04:50, Athaliah

Two wafer sizes are to be compared: a 156-mm wafer with a processable area = 150-mm diameter circle, and a 312-mm wafer with a processable area = 300-mm diameter circle. the ic chips in both cases are square with 10 mm on a side. assume the cut lines (streets) between chips are of negligible width. what is the percent increase in (a) processable wafer diameter, (b) processable wafer area, and (c) number of chips for the larger wafer size?

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Business, 13.07.2019 11:30, haileysolis5

For the current batch size of 100 wafers, how long would it take to produce 50 wafers? assume that the batch needs to stay together during deposition and patterning (i.e., the firm does not work with transfer batches that are less than the production batch). however, the 50 wafers can leave the process the moment all 50 wafers have passed through the etching stage. recall that a setup can only be started upon the arrival of the batch at the machine. c. for what batch size is step 3 (etching) the bottleneck? d. suppose jcl inc. came up with a new technology that eliminated the setup time for step 1 (deposition), but increased the processing time to 0.45 min./unit. what would be the batch size you would choose so as to maximize the overall cap

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Engineering, 13.09.2019 22:30, BrandonBBB

Two wafer sizes are to be compared: a 156-mm wafer with a processable area = 150mm diameter circle and a 312-mm wafer with a processable area = 300mm diameter circle. the ic chips in both cases are square with 10 mm on a side? assume the cut lines (streets) between chips are of negligible width. what is the percent increase in (a) wafer diameter, (b) processable wafer area, and (c) number of chips for the larger wafer size?

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Engineering, 13.09.2019 22:30, ninaaforever

Asilicon boule has been processed through grinding to provide a cylinder whose diameter 285 mm and whose length 900 mm. next, it will be sliced into wafers 0.7 mm thick usinga cut-off saw with a kerf 0.5 mm. the wafers thus produced will be used to fabricate as many ic chips as possible for the personal computer market. each ic has a market value to the company of r98. each chip is square with 15 mm on a side. the processable area of each wafer is defined by a diameter 270 mm. estimate the value of all of the ic chips that could be produced, assuming an overall yield of 80% good product.

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The yield of good chips in multiprobe for a certain batch of wafers is 75%. the wafers have a diamet...

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