Engineering
Engineering, 13.09.2019 22:30, hollie62

The yield of good chips in multiprobe for a certain batch of wafers is 75%. the wafers have a diameter of 300 mm with a processable area that is 280 mm in diameter. if the defects are all assumed to be point defects, determine the density of point defects using the bose-einstein method of estimating yield.

answer
Answers: 2

Similar questions

Do you know the correct answer?
The yield of good chips in multiprobe for a certain batch of wafers is 75%. the wafers have a diamet...

Questions in other subjects: