The heat generated in the circuitry on the surface of a silicon chip (k=130 w/m°c) is conducted to the ceramic substrate to which it is attached. the chip is 6 mm × 6 mm in size and 0.5 mm thick and dissipates 3 w of power. disregarding any heat transfer through the 0.5 mm high side surfaces, determine the temperature difference between the front and back surfaces of the chip in steady operation

Aloaded platform of total mass 500 kg is supported by a dashpot and by a set of springs of effective stiffness 72 kn/m. it is observed that when the platform is depressed through a distance x = 12.5 cm below its equilibrium position and then released without any initial velocity; it reaches its equilibrium position in the shortest possible time without overshoot. find the position and velocity of the loaded platform 0.10 sec. after its release. if a further load of 400 kg is added to the platform, find, i) the frequency of damped vibrations, and i) the amplitude of vibration after 2 complete oscillations, given that the initial amplitude is 15 cm.

Asimple rankine cycle uses water as the working fluid. the water enters the turbine at 10 mpa and 480c while the condenser operates at 6 kpa. if the turbine has an isentropic efficiency of 80 percent while the pump has an isentropic efficiency of 70 percent determine the thermal efficiency

Air flows over a heated plate àt a velocity of 50m/s. the local skin factor coefficient at a point on a plate is 0.004. estimate the local heat transfer coefficient at this point. the following property data for air are given: density = 0.88kg/m3 , viscosity 2.286 x 10 ^-5 kgm/s , k = 0.035w/mk ,cp = 1.001kj/kgk. use colburn reynolds analogy.