An array of computer processors is mounted within a sealed square enclosure; cooling is implemented by attaching an aluminum heat sink (k-180 w/m"k). the base of the sink has side length of 100 mm, while the 6 fins are of thickness 10 mm, have a pitch (distance between centers) of 18 mm, and length 40 mm. assume the thermal resistance in the base layer is very thin. if cooling is implemented by 20°c water flow through the heat sink at a velocity of 4 m/s, what is the base temperature? when computing average heat transfer coefficient over the fins, one may assume parallel flow over a flat plate. (water properties: k=0.62 w/m"? , p=995 kg/m3, cp=4178 j/kg"k, v=7.73 x 10^-7 m/s)