For each of the following process: a) sketch the p-v diagram, b)sketch t-s diagram, c) sketch t-v diagram, d) sketch the boundary work on one of the diagrams (a, b or c) and e) sketch the reversible heat transfer on one of the diagrams (a, b or c): 1- isobaric process from compressed liquid to superheated vapor 2- isothermal process from compressed liquid to superheated vapor 3- isentropic process from compressed liquid to superheated vapor

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction